MIL-STD-883 Substrate Attach Strength Testing
Substrate attach strength testing determines an element’s strength when subjected to force in the Y1 axis. As a certified environmental lab, we realize the importance of MIL-STD 883 testing. Meeting the environmental substrate strength requirements can be difficult. We understand the challenges and guide companies through the process.
When products do not meet the requirements, we assist with finding solutions. Keystone Compliance partners with customers to achieve environmental product compliance. Our pricing is competitive and we offer volume discounts. Lastly, Keystone takes a consultative approach throughout the entire test program.
Request a quote to see why so many companies partner with Keystone Compliance. Ready to get started? We are. Contact us to see why so many companies work with us to achieve their environmental standard testing needs.
Summary of Military Standard 883 Testing Information
The 883 military test procedure is applicable to semiconductor die attached to headers or substrates by means of organic materials. Uses of this method include material evaluations and process control.
The MIL-883 test equipment consists of tensile strength testers. These testers are capable of applying force equal to 1,000 psi times the area of the largest die to be tested. The test equipment must also follow capabilities such as:
- A range of replaceable die contact tools.
- Provisions to assure that the die contact tool is held perpendicular to the die mounting plane of the header or substrate.
- A rational capability between the die contact tool and the header/substrate holding fixture.
The following data and test information is specified in the applicable acquisition document:
- Minimum dye pull strength.
- Number of die to be tested and the acceptance number.
- Requirements for data recording.
MIL-STD-883 Procedures of Substrate Attach Strength Testing
The 883 compliance test is conducted by placing a small amount of a quick settling adhesive on the contacting tool. Then, the tool is attached to the die surface. After sufficient adhesive curing, the sample is subjected to a vertical pull force.
A force sufficient to lift the die from its mounting is applied. If the separation occurs between the die surface and the die contacting tool, at less than twice the minimum specified tensile strength, the particular die test is not conducted in the sample as either passing or failing.
Expert MIL-STD-883 Lab Testing Services
In addition to environmental 883 substrate die testing, Keystone has a full scope of expertise including sand and dust, humidity, pyroshock, and solar radiation. Our team strives to give our customers more time and energy on product development instead of testing. Keystone has a full lab of test equipment which permits us to provide short lead times on scheduling.
Ready to get started? We are. Contact us to see why so many companies work with us to achieve their environmental standard testing needs.