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Amazon Type A – 2019-08-16T085859.793

MIL-STD-883 Microcircuits Compliance Testing

MIL-STD-883 is the military test standard that establishes uniform methods, controls, and procedures for testing microelectronic devices. The objective is to identify devices suitable for use within military and aerospace electronic systems that withstand the deleterious effects of natural elements and conditions.

Keystone Compliance has significant experience testing devices to MIL-883. Our experts have a thorough understanding of military testing standards. We guide manufacturers through the certification process from the development if a test plan to the issuance of a test report. As an ISO-17025 accredited test lab, our test reports are recognized around the globe.

For more information, please contact us or Request a Quote. We can speak to your specific testing needs. For more information about MIL-STD-883 testing, please continue reading the remainder of this page.

MIL-STD 883 defines devices as items such as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.

There are three primary objectives of this military compliance standard. First, is to specify suitable conditions obtainable in the laboratory and at the device level. These conditions give test results equivalent to the actual service conditions existing in the field. It is crucial to obtain reproducibility of the results of tests.

The second objective is to describe in one standard all of the test methods of a similar character which appear in the various joint-services and NASA microelectronic device specifications. This is an objective so that these methods may be kept uniform. The result is a conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices.

The last objective is to provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials. This will ensure consistent quality and reliability among all devices screened in accordance with the testing standard.

The standard is broken down into five series. Included below is a summary of all of the tests and links to additional information for some of the testing.

Environmental Tests:

Mechanical Tests:

  • MIL-STD-883 Method Number 2001 Constant acceleration
  • MIL-STD-883 Method Number 2002 Mechanical shock
  • MIL-STD-883 Method Number 2003 Solderability
  • MIL-STD-883 Method Number 2004 Lead integrity
  • MIL-STD-883 Method Number 2005 Vibration fatigue
  • MIL-STD-883 Method Number 2006 Vibration noise
  • MIL-STD-883 Method Number 2007 Vibration, variable frequency
  • MIL-STD-883 Method Number 2008 Visual and mechanical
  • MIL-STD-883 Method Number 2009 External visual
  • MIL-STD-883 Method Number 2010 Internal visual (monolithic)
  • MIL-STD-883 Method Number 2011 Bond strength (destructive bond pull test)
  • MIL-STD-883 Method Number 2012 Radiography
  • MIL-STD-883 Method Number 2013 Internal visual inspection for DPA
  • MIL-STD-883 Method Number 2014 Internal visual and mechanical
  • MIL-STD-883 Method Number 2015 Resistance to solvents
  • MIL-STD-883 Method Number 2016 Physical dimensions
  • MIL-STD-883 Method Number 2017 Internal visual (hybrid)
  • MIL-STD-883 Method Number 2018 Scanning electron microscope (SEM) inspection of metallization
  • MIL-STD-883 Method Number 2019 Die shear strength
  • MIL-STD-883 Method Number 2020 Particle impact noise detection test
  • MIL-STD-883 Method Number 2021 Glassivation layer integrity
  • MIL-STD-883 Method Number 2022 Wetting balance solderability
  • MIL-STD-883 Method Number 2023 Nondestructive bond pull
  • MIL-STD-883 Method Number 2024 Lid torque for glass-frit-sealed packages
  • MIL-STD-883 Method Number 2025 Adhesion of lead finish
  • MIL-STD-883 Method Number 2026 Random vibration
  • MIL-STD-883 Method Number 2027 Substrate attach strength
  • MIL-STD-883 Method Number 2028 Pin grid package destructive lead pull test
  • MIL-STD-883 Method Number 2029 Ceramic chip carrier bond strength
  • MIL-STD-883 Method Number 2030 Ultrasonic inspection of die attach
  • MIL-STD-883 Method Number 2031 Flip chip pull-off test
  • MIL-STD-883 Method Number 2032 Visual inspection of passive elements
  • MIL-STD-883 Method Number 2035 Ultrasonic inspection of TAB bonds
  • MIL-STD-883 Method Number 2036 Resistance to soldering heat

Electrical tests (digital):

  • MIL-STD-883 Method Number 3001 Drive source, dynamic
  • MIL-STD-883 Method Number 3002 Load conditions
  • MIL-STD-883 Method Number 3003 Delay measurements
  • MIL-STD-883 Method Number 3004 Transition time measurements
  • MIL-STD-883 Method Number 3005 Power supply current
  • MIL-STD-883 Method Number 3006 High level output voltage
  • MIL-STD-883 Method Number 3007 Low level output voltage
  • MIL-STD-883 Method Number 3008 Breakdown voltage, input or output
  • MIL-STD-883 Method Number 3009 Input current, low level
  • MIL-STD-883 Method Number 3010 Input current, high level
  • MIL-STD-883 Method Number 3011 Output short circuit current
  • MIL-STD-883 Method Number 3012 Terminal capacitance
  • MIL-STD-883 Method Number 3013 Noise margin measurements for digital microelectronic devices
  • MIL-STD-883 Method Number 3014 Functional testing
  • MIL-STD-883 Method Number 3015 Electrostatic discharge sensitivity classification
  • MIL-STD-883 Method Number 3016 Activation time verification
  • MIL-STD-883 Method Number 3017 Microelectronics package digital signal transmission
  • MIL-STD-883 Method Number 3018 Crosstalk measurements for digital microelectronic device packages
  • MIL-STD-883 Method Number 3019 Ground and power supply impedance measurements for digital microelectronics device packages
  • MIL-STD-883 Method Number 3020 High impedance (off-state) low-level output leakage current
  • MIL-STD-883 Method Number 3021 High impedance (off-state) high-level output leakage current
  • MIL-STD-883 Method Number 3022 Input clamp voltage
  • MIL-STD-883 Method Number 3023 Static latch-up measurements for digital CMOS microelectronic devices
  • MIL-STD-883 Method Number 3024 Simultaneous switching noise measurements for digital microelectronic devices

 

Electrical tests (linear):

  • MIL-STD-883 Method Number 4001.1 Input offset voltage and current and bias current
  • MIL-STD-883 Method Number 4002.1 Phase margin and slew rate measurements
  • MIL-STD-883 Method Number 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio
  • MIL-STD-883 Method Number 4004.2 Open loop performance
  • MIL-STD-883 Method Number 4005.1 Output performance
  • MIL-STD-883 Method Number 4006 Power gain and noise figure
  • MIL-STD-883 Method Number 4007 Automatic gain control range

Test Procedures:

  • MIL-STD-883 Method Number 5001 Parameter mean value control
  • MIL-STD-883 Method Number 5002 Parameter distribution control
  • MIL-STD-883 Method Number 5003 Failure analysis procedures for microcircuits
  • MIL-STD-883 Method Number 5004 Screening procedures
  • MIL-STD-883 Method Number 5005 Qualification and quality conformance procedures
  • MIL-STD-883 Method Number 5006 Limit testing
  • MIL-STD-883 Method Number 5007 Wafer lot acceptance
  • MIL-STD-883 Method Number 5008 Test procedures for hybrid and multichip microcircuits
  • MIL-STD-883 Method Number 5009 Destructive physical analysis
  • MIL-STD-883 Method Number 5010 Test procedures for custom monolithic microcircuits
  • MIL-STD-883 Method Number 5011 Evaluation and acceptance procedures for polymeric adhesives
  • MIL-STD-883 Method Number 5012 Fault coverage measurement for digital microcircuits
  • MIL-STD-883 Method Number 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers

MIL-STD-883 is revised periodically. The existing versions of the standard include MIL-STD-883 J, MIL-STD-883 I, MIL-STD-883 H, MIL-STD-883 G, MIL-STD-883 F, MIL-STD-883 E, MIL-STD-883 D, MIL-STD-883 C, MIL-STD-883 B and MIL-STD-883 A.

Keystone Compliance assists manufacturers with MIL-STD-833 compliance. This page lists every method and section of the standard for informational purposes. There may be methods and sections that fall outside of our scope. Please contact us for more information on how Keystone Compliance can assist you with identifying and fulfilling your MIL-STD-833 testing needs.