MIL-STD-750 Testing
MIL-STD 750 establishes uniform methods for testing semiconductor devices, including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military operations, and physical and electrical tests. For the purpose of MIL STD 750, the term “devices” includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This standard is intended to apply only to semiconductor devices.
Method Number Title
Environmental tests (1000 series)
MIL-STD-750 Method Number 1001.2 Barometric pressure (reduced)
MIL-STD-750 Method Number 1011.1 Immersion
MIL-STD-750 Method Number 1015.1 Steady-state primary photocurrent irradiation procedure (electron beam)
MIL-STD-750 Method Number 1016 Insulation resistance
MIL-STD-750 Method Number 1017.1 Neutron irradiation
MIL-STD-750 Method Number 1018.3 Internal gas analysis
MIL-STD-750 Method Number 1019.5 Steady-state total dose irradiation procedure
MIL-STD-750 Method Number 1020.2 Electrostatic discharge sensitivity (ESDS) classification
MIL-STD-750 Method Number 1021.3 Moisture resistance
MIL-STD-750 Method Number 1022.5 Resistance to solvents
MIL-STD-750 Method Number 1026.5 Steady-state operation life
MIL-STD-750 Method Number 1027.3 Steady-state operation life (sample plan)
MIL-STD-750 Method Number 1031.5 High-temperature life (non-operating)
MIL-STD-750 Method Number 1032.2 High-temperature (non-operating) life (sample plan)
MIL-STD-750 Method Number 1033 Reverse voltage leakage stability
MIL-STD-750 Method Number 1036.3 Intermittent operation life
MIL-STD-750 Method Number 1037.2 Intermittent operation life (sample plan)
MIL-STD-750 Method Number 1038.4 Burn-in (for diodes, rectifiers, and zeners)
MIL-STD-750 Method Number 1039.4 Burn-in (for transistors)
MIL-STD-750 Method Number 1040 Burn-in (for thyristors (controlled rectifiers)
MIL-STD-750 Method Number 1041.3 Salt atmosphere (corrosion)
MIL-STD-750 Method Number 1042.3 Burn-in and life test for power MOSFET’s or insulated gate bipolar transistors (IGBT)
MIL-STD-750 Method Number 1046.3 Salt spray (corrosion)
MIL-STD-750 Method Number 1048 Blocking life
MIL-STD-750 Method Number 1049 Blocking life (sample plan)
MIL-STD-750 Method Number 1051.6 Temperature cycling (air to air)
MIL-STD-750 Method Number 1054.1 Potted environment stress test
MIL-STD-750 Method Number 1055.1 Monitored mission temperature cycle
MIL-STD-750 Method Number 1056.7 Thermal shock (liquid to liquid)
MIL-STD-750 Method Number 1057.1 Resistance to glass cracking
MIL-STD-750 Method Number 1061.1 Temperature measurement, case and stud
MIL-STD-750 Method Number 1066.1 Dew point
MIL-STD-750 Method Number 1071.8 Hermetic seal
MIL-STD-750 Method Number 1080 Single event burnout and single event gate rupture test
Mechanical characteristics tests (2000 series)
MIL-STD-750 Method Number 2005.2 Axial lead tensile test
MIL-STD-750 Method Number 2006 Constant acceleration
MIL-STD-750 Method Number 2016.2 Shock
MIL-STD-750 Method Number 2017.2 Die attach integrity
MIL-STD-750 Method Number 2026.11 Solderability
MIL-STD-750 Method Number 2031.3 Resistance to soldering heat
MIL-STD-750 Method Number 2036.4 Terminal strength
MIL-STD-750 Method Number 2037.1 Bond strength
MIL-STD-750 Method Number 2046.2 Vibration fatigue
MIL-STD-750 Method Number 2051.1 Vibration noise
MIL-STD-750 Method Number 2052.4 Particle impact noise detection (PIND) test
MIL-STD-750 Method Number 2056 Vibration, variable frequency
MIL-STD-750 Method Number 2057.2 Vibration, variable frequency (monitored)
MIL-STD-750 Method Number 2066 Physical dimensions
MIL-STD-750 Method Number 2068 External visual for nontransparent, glass-encased, double plug, non-cavity, axial leaded diodes
MIL-STD-750 Method Number 2069.2 Pre-cap visual, power MOSFET’s
MIL-STD-750 Method Number 2070.2 Pre-cap visual microwave discrete and multichip transistors
MIL-STD-750 Method Number 2071.6 Visual and mechanical examination
MIL-STD-750 Method Number 2072.6 Internal visual transistor (pre-cap) inspection
MIL-STD-750 Method Number 2073.1 Internal inspection for die (semiconductor diode)
MIL-STD-750 Method Number 2074.4 Internal visual inspection (discrete semiconductor diodes)
MIL-STD-750 Method Number 2075.1 Decap internal visual design verification
MIL-STD-750 Method Number 2076.3 Radiography
MIL-STD-750 Method Number 2077.3 Scanning electron microscope (SEM) inspection of metallization
MIL-STD-750 Method Number 2078 Internal visual for wire bonded diodes/rectifiers
MIL-STD-750 Method Number 2081 Forward instability, shock (FIST)
MIL-STD-750 Method Number 2082 Backward instability, vibration (BIST)
MIL-STD-750 Method Number 2101.1 DPA procedures for diodes
MIL-STD-750 Method Number 2102 DPA for wire bonded devices
MIL-STD-750 Method Number 2103 Design verification for surface mount devices
MIL-STD-750 is revised periodically. The existing versions of the standard include MIL-STD-750 F, MIL-STD-750 E, MIL-STD-750 D, MIL-STD-750 C, MIL-STD-750 B, MIL-STD-750 A, MIL-STD-750/5, MIL-STD-750/4, MIL-STD-750/3, MIL-STD-750/2 and MIL-STD-750/1.
Keystone Compliance assists manufacturers with MIL-STD-750 compliance. This page lists every method and section of the standard for informational purposes. There may be methods and sections that fall outside of our scope. Please contact us for more information on how Keystone Compliance can assist you with identifying and fulfilling your MIL-STD-750 needs.
