MIL-STD 883 Intermittent Life Testing
MIL-STD-883 reliability testing helps determine a representative failure rate for microelectronic devices. It also demonstrates the quality or reliability of devices subjected to the specified conditions. It is intended for devices exposed to variations in electrical stresses between “on” and “off”, and resulting variations in temperature.
Keystone Compliance is an intermittent life testing lab, with significant compliance testing experience. Our test engineers understand the requirements of MIL-883 intermittent life and MIL-883 reliability testing. The following information is extremely technical in nature. Below is provided a summary of the requirements of MIL-STD 883 reliability testing.
What is Needed for Testing in the Reliability Laboratory?
All intermittent life compliance testing should take place in a fully equipped intermittent life laboratory. Suitable sockets are needed to make firm electrical contact to the terminals of devices in the specified circuit configuration. Generally, the mounting means should not remove internally-dissipated heat from the device by conduction. Heat may be removed through the device terminals, the necessary electrical contacts and the gas or liquid chamber medium.
The apparatus should maintain the specified biases at the terminals of the device under test and. They should also, when specified, monitor the input excitation or output response. Power supplies and current-setting resistors should be capable of maintaining the minimum specified operating conditions throughout testing. Power supplies must be capable of handling variations in source voltages, ambient temperatures, etc.
Sometimes test conditions will result in significant power dissipation. In this case the test apparatus will be arranged to result in the approximate average power dissipation for each device. This can occur whether devices are tested individually or in a group.
The test circuits need not compensate for normal variations in individual device characteristics. They are arranged so abnormal devices in a group do not affect the test for the rest of the group. Failed or abnormal devices will not receive a reliability certification.
What Procedure Achieves the Best Intermittent Life Testing?
Microelectronic devices are subjected to the specified test condition for the specified duration at the specified test temperature. The required measurements are made at the specified midway points and end points. Certified and qualified QML manufacturers may modify test time or condition, provided the change is in the QM plan. The “Q” certification identifier must be marked on the devices.
Lead-, stud-, or casonee-mounted devices are mounted by the leads, stud, or case in their normal mounting configuratideviceon. The point of connection is maintained at a temperature not less than the specified ambient temperature. The test condition, duration, sample size, and temperature selected prior to the test is recorded and used for the entire test. Test boards should not employ load resistors common to multiple devices, or to multiple output pins on .
For this method all electrical stresses should be alternately applied and removed. The “on” and “off” periods are begun by sudden, not gradual, application or removal of the specified electrical inputs. These electrical inputs include signal and bias.
What Detail for Reliability Compliance Testing Are Specified in Acquisition Documents?
Expect the following details to specified in the applicable acquisition documents:
- Special preconditioning, when applicable.
- Test temperature, and whether ambient, junction, or case.
- Test duration.
- Test mounting.
- Test condition letter.
- End-point measurements and midway measurements.
- Criteria for device failure for midway and end-point measurements, if other than device specification limits, and criteria for lot acceptance.
- Test sample.
- Time to complete end-point measurements.
- Approval for use of condition F and special maximum test rating for condition F, when applicable.
- Time temperature conditions for condition F.
- Frequency and duration of “on” and “off” cycles.
What Reliability Testing Lab Provides the Best Reliability Testing?
Keystone Compliance has been recognized as one of the best reliability labs in the country. Our test engineers are capable of providing intermittent life certification for commercial, militrat, and aerospace products. Our fully equipped facilities make us one of the best intermittent life labs around. Contact us to learn why so many manufacturers rely on Keystone Compliance’s testing services to meet their compliance testing needs.
MIL-STD-883 testing contains several test methods. For more information about these test methods, please click on one of the links below.
- Method 1001 Barometric pressure, reduced (altitude operation)
- Method 1002 Immersion
- Method 1004 Moisture resistance
- Method 1005 Steady-state life
- Method 1006 Intermittent life
- Method 1007 Agree life
- Method 1008 Stabilization bake
- Method 1009 Salt atmosphere
- Method 1010 Temperature cycling
- Method 1011 Thermal shock
- Method 1012 Thermal characteristics
- Method 1013 Dew point
- Method 2001 Constant acceleration
- Method 2002 Mechanical shock
- Method 2005 Vibration fatigue
- Method 2006 Vibration noise
- Method 2007 Vibration, variable frequency
- Method 2015 Resistance to solvents
- Method 2026 Random vibration