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MIL-STD 810 Fungus Testing

The purpose of MIL-STD-810 fungal testing is to assess the sensitivity of materials to fungal growth. Since microbial breakdown is a function of temperature and humidity, consider it in the design of all standard material. It helps determine if the materials will support fungal growth, and identify where dominant species may appear. It also helps determine how rapidly fungus will grow on the material.

MIL-810 fungal testing determines how fungus affects material  mission and safety for use following the growth of fungus on the material. This test helps determine if the material can be stored effectively in a field environment. It also helps determine what simple cleaning processes are best.

This test is designed to obtain data on the weakness of material. This method is not intended for but may be used to test basic materials. Various other test procedures, including pure culture, mixed culture, and plate testing are available. Keystone Compliance has a fully equipped fungus testing lab.

Keystone’s test engineers understand  MIL-STD-810 fungus, which is drawn from MIL-STD 810G fungus and MIL-STD 810H fungus. The following information provides a summary of MIL-810 fungus, method 508.7. It applies previous versions of the standard. This includes MIL-810G fungus and MIL-810H fungus.

What are the Effects of Fungal Growth on Materials?

This method helps determine if fungal growth will occur and how it may degrade or impact the use of the material. Fungal growth impairs the functioning or use of material by changing its physical properties.

Non-Resistant materials are susceptible to direct attack as the fungus breaks the materials down and uses them as nutrients. Examples of non-resistant materials are:

  • Natural Materials. Products of natural origin are most susceptible to this attack.
  • Cellulosic materials (e.g., wood, paper, natural fiber textiles, and cordage).
  • Animal and vegetable based adhesives.
  • Greases, oils, and many hydrocarbons.
  • Leather.
  • Synthetic Materials.
  • PVC formulations (e.g., those plasticized with fatty acid esters).
  • Certain polyurethanes (e.g., polyesters and some polyethers).
  • Plastics that contain organic fillers of laminating materials.
  • Paints and varnishes that contain susceptible constituents.

Indirect attacks may also cause damage to fungus-resistant materials. Fungal growth on dust, grease, perspiration, et cetera, may damage the underlying material, even if it is resistant to direct attack. Metabolic waste products excreted by fungus cause corrosion of metals, etching of glass, or degrading of plastics and other materials. The products of fungus on adjacent materials that are susceptible to direct attack come in contact with the resistant materials.

When Can Physical Interference Occur During Testing?

Physical interference can occur in electrical systems. Damage to electrical or electronic systems may result from either direct or indirect attack. Fungi can form unwanted electrical conducting paths across insulating materials. Or may adversely affect the electrical characteristics of critically adjusted electronic circuits.

Physical interference can also occur in optical systems. Damage to optical systems results primarily from indirect attack. Fungus can affect light transmission through the optical system or block delicate moving parts and etched glass. It may also change non-wetting surfaces to wetting surfaces with resulting loss in performance.

What are the Health and Aesthetic Factors of Fungus?

810G fungal testing and 810H fungal testing is necessary because fungus on materiel can cause physiological problems. These may include allergies or some form of fungal disease. It can also be so aesthetically unpleasant that the users will be reluctant to use the material.

What is the Appropriate Test Duration for the Best Fungus Testing?

The minimum test period is 28 days. This time allows for fungus germination, breakdown of carbon-containing molecules, and degradation of material. However, indirect effects and physical interference are not likely to occur in the relatively short time frame of the fungus test. Consider extending the exposure period to 84 days if more certainty is required to determine the existence or effect of fungus.

What Fungus is best used for Fungus Compliance Testing?

The fungi used for this test must be able to degrade materials, have worldwide distribution, and be stable. They must also have a Biological Safety Level 1 classification. These organisms have, where possible, been identified with respect to the materials to which they are known to attack. Substitution of the species is not recommended.

Test items may not be sterile before testing, so other microorganisms may be present on the surface. When the test item is injected with the test fungi, both these and the other organisms will compete for available nutrients. Organisms other than the test fungi are commonly found growing on the test item at the end of the test. Thus all testing should be performed by a trained professional in a fungus laboratory.

You may add, but not substitute, additional species of fungus to those required in this test Method. However, if additional fungi are used, base their selection on prior knowledge of specific material decay. Consult a trained personnel, e.g., mycologists, microbiologists, et cetera, to identify when this is appropriate.

Who should I trust for Fungal Certification for my Product?

Keystone Compliance has been recognized as one of the best fungus labs in the country. We employ the best test engineers, provided with high quality equipment. Our experts have extensive knowledge of MIL-810G fungal and MIL-810H fungal testing standards.

Fungus certification testing for commercial, military, and aerospace products. We are one of the most trusted compliance certification labs in the country. Contact us to learn why so many manufacturers rely on Keystone Compliance to meet their compliance testing needs.

There have been several versions of fungus testing procedures in MIL-STD-810 Fungus Testing. Below is a list of each version and the appropriate method number: