Select Page

MIL-STD-883 Testing

MIL-STD 883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of MIL STD 883, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.

Environmental Tests (1000 Series)

MIL-STD-883 Method Number 1001 Barometric pressure, reduced (altitude operation)
MIL-STD-883 Method Number 1002 Immersion
MIL-STD-883 Method Number 1003 Insulation resistance
MIL-STD-883 Method Number 1004.7 Moisture resistance
MIL-STD-883 Method Number 1005.9 Steady state life
MIL-STD-883 Method Number 1006 Intermittent life
MIL-STD-883 Method Number 1007 Agree life
MIL-STD-883 Method Number 1008.2 Stabilization bake
MIL-STD-883 Method Number 1009.8 Salt atmosphere (corrosion)
MIL-STD-883 Method Number 1010.8 Temperature cycling
MIL-STD-883 Method Number 1011.9 Thermal shock
MIL-STD-883 Method Number 1012.1 Thermal characteristics
MIL-STD-883 Method Number 1013 Dew point
MIL-STD-883 Method Number 1014.13 Seal
MIL-STD-883 Method Number 1015.10 Burn-in test
MIL-STD-883 Method Number 1016.2 Life/reliability characterization tests
MIL-STD-883 Method Number 1017.2 Neutron irradiation
MIL-STD-883 Method Number 1018.6 Internal gas analysis
MIL-STD-883 Method Number 1019.8 Ionizing radiation (total dose) test procedure
MIL-STD-883 Method Number 1020.1 Dose rate induced latchup test procedure
MIL-STD-883 Method Number 1021.3 Dose rate upset testing of digital microcircuits
MIL-STD-883 Method Number 1022 Mosfet threshold voltage
MIL-STD-883 Method Number 1023.3 Dose rate response of linear microcircuits
MIL-STD-883 Method Number 1030.2 Preseal burn-in
MIL-STD-883 Method Number 1031 Thin film corrosion test
MIL-STD-883 Method Number 1032.1 Package induced soft error test procedure (due to alpha particles)
MIL-STD-883 Method Number 1033 Endurance life test
MIL-STD-883 Method Number 1034.1 Die penetrant test (for plastic devices)


Mechanical Tests (2000 Series)

MIL-STD-883 Method Number 2001.3 Constant acceleration
MIL-STD-883 Method Number 2002.5 Mechanical shock
MIL-STD-883 Method Number 2003.9 Solderability
MIL-STD-883 Method Number 2004.6 Lead integrity
MIL-STD-883 Method Number 2005.2 Vibration fatigue
MIL-STD-883 Method Number 2006.1 Vibration noise
MIL-STD-883 Method Number 2007.3 Vibration, variable frequency
MIL-STD-883 Method Number 2008.1 Visual and mechanical
MIL-STD-883 Method Number 2009.10 External visual
MIL-STD-883 Method Number 2010.12 Internal visual (monolithic)
MIL-STD-883 Method Number 2011.8 Bond strength (destructive bond pull test)
MIL-STD-883 Method Number 2012.8 Radiography
MIL-STD-883 Method Number 2013.1 Internal visual inspection for DPA
MIL-STD-883 Method Number 2014 Internal visual and mechanical
MIL-STD-883 Method Number 2015.13 Resistance to solvents
MIL-STD-883 Method Number 2016 Physical dimensions
MIL-STD-883 Method Number 2017.9 Internal visual (hybrid)
MIL-STD-883 Method Number 2018.5 Scanning electron microscope (SEM) inspection of metallization
MIL-STD-883 Method Number 2019.8 Die shear strength
MIL-STD-883 Method Number 2020.9 Particle impact noise detection test
MIL-STD-883 Method Number 2021.3 Glassivation layer integrity
MIL-STD-883 Method Number 2022.2 Wetting balance solderability
MIL-STD-883 Method Number 2023.6 Nondestructive bond pull
MIL-STD-883 Method Number 2024.2 Lid torque for glass-frit-sealed packages
MIL-STD-883 Method Number 2025.4 Adhesion of lead finish
MIL-STD-883 Method Number 2026 Random vibration
MIL-STD-883 Method Number 2027.2 Substrate attach strength
MIL-STD-883 Method Number 2028.4 Pin grid package destructive lead pull test
MIL-STD-883 Method Number 2029 Ceramic chip carrier bond strength
MIL-STD-883 Method Number 2030.1 Ultrasonic inspection of die attach
MIL-STD-883 Method Number 2031.1 Flip chip pull-off test
MIL-STD-883 Method Number 2032.2 Visual inspection of passive elements
MIL-STD-883 Method Number 2035 Ultrasonic inspection of TAB bonds
MIL-STD-883 Method Number 2036 Resistance to soldering heat


MIL-STD-883 is revised periodically. The existing versions of the standard include MIL-STD-883 J, MIL-STD-883 I, MIL-STD-883 H, MIL-STD-883 G, MIL-STD-883 F, MIL-STD-883 E, MIL-STD-883 D, MIL-STD-883 C, MIL-STD-883 B and MIL-STD-883 A.

Keystone Compliance assists manufacturers with MIL-STD-833 compliance. This page lists every method and section of the standard for informational purposes. There may be methods and sections that fall outside of our scope. Please contact us for more information on how Keystone Compliance can assist you with identifying and fulfilling your MIL-STD-833 needs.